★ Typical Properties of JOJUN-6100 Series Thermal Pad
|
Typical Properties Of JOJUN6100
|
|
Property
|
Unit
|
Product Series
|
Test Method
|
|
JOJUN6100
|
|
Color
|
|
Customized
|
Visual
|
|
Thickness
|
mm
|
0.5-5
|
ASTM D374
|
|
Specific Gravity
|
g/cc
|
2.8
|
ASTM D792
|
|
Hardness
|
Shore oo
|
30-70
|
ASTM D2240
|
|
Application Temperature
|
℃
|
-50 - +200
|
|
|
Flammability Class
|
|
V0
|
UL94
|
|
Thermal Conductivity
|
W/m-K
|
1
|
ASTM D5470
|
|
Breakdown Voltage
|
KV/mm
|
>6
|
ASTM D149
|
|
Volume Resistivity
|
ohm-cm
|
10 ^14
|
ASTM D257
|
|
Dielectric Constant
|
1MHz
|
7
|
ASTM D150
|
★ Application
1. LED industry
The thermal conductive gasket is used between the aluminum substrate and the heat sink.
The thermal conductive gasket is used between the aluminum substrate and the shell.
2. Power industry
Use the heat conduction between MOS tube, transformer (or capacitor/PFC inductor) and heat sink or housing.
3. Communication industry
Thermal conduction and heat dissipation between the main board IC and the heat sink or shell.
Heat conduction and heat dissipation between the set-top box DC-DC IC and the shell.
4. Automotive Electronics Industry
Thermal conductive gaskets can be used in automotive electronic industry applications (such as xenon lamp ballasts, stereos, vehicle series products, etc.).
5. PDP/LED TV
Heat conduction between power amplifier IC, image decoder IC and heat sink (housing).
★ Production Process
Mix Stir
Extrusion
Thermal Pad Production Line
Crop
Package
Outgoing Goods
★R&D Center
Voltage Breakdown Tester
Thermal Conductivity Tester
Kneader
Laboratory
★ Popular Science Knowledge
Thermal conductive gaskets are used to fill the air gap between the heating device and the heat sink or metal base. Their flexible and elastic characteristics enable them to cover very uneven surfaces. Heat is transmitted from the separation device or the entire PCB to the metal shell or diffusion plate, which can improve the efficiency and service life of the heating electronic components. The heat conduction pad is installed between the heat dissipation cold plate and the heating chip to transmit the heat generated by the chip to the heat dissipation cold plate, thereby reducing the temperature of the chip. The compression stress will occur when the heat conduction pad is compressed. The compression stress will increase with the increase of the compression amount. When selecting the heat conduction pad, pay attention that the compression stress of the heat conduction pad during compression should not be greater than the maximum required pressure of the heating chip, otherwise the chip will be damaged.
★ Why Choose Us?
1. Professional R&D team
Application test support ensures that you no longer worry about multiple test instruments.
2. Product marketing cooperation
The products are sold to many countries all over the world.
3. Strict quality control
4. Stable delivery time and reasonable order delivery time control.
We are a professional team, our members have many years of experience in international trade. We are a young team, full of inspiration and innovation. We are a dedicated team. We use qualified products to satisfy customers and win their trust. We are a team with dreams. Our common dream is to provide customers with the most reliable products and improve together. Trust us, win-win.
★ Certificates